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CXT-PLA3SA12450A is a 3-phase 1200V/450A Silicon Carbide (SiC) MOSFET Intelligent Power Module integrating the power switches and a gate driver based on the CISSOID HADES2 chipset. Cooled down through a lightweight AlSiC Pin Fin baseplate, this module addresses high power density converters offering a SiC power module designed for operation at high junction temperature up to 175°C. Compared to IGBT modules, this solution gives access to the full benefits of SiC technology to achieve high efficiency, high power density and high reliability thanks to low switching losses and high temperature operation. The integration of the gate driver together with the power module gives direct access to a fully validated and optimized solution in terms of switching speed and losses, robustness against dI/dt and dV/dt and protection of the power stages (Desat, UVLO, AMC, SSD).

Key Features

  • Power Devices Junction Temperature: -40°C to +175°C
  • Gate Driver Ambient Temperature: -40°C to 125°C
  • Drain-to-source Breakdown Voltage: 1200V
  • Low On Resistance: 3.25mOhms typ.
  • Max Continuous Current: 450A/300A at Tc=25°C/90°C
  • Lightweight AlSiC Pin Fin baseplate for liquid cooling
  • Junction-to-case Thermal Resistance: 0.13 °C/W typ.
  • Switching Energy@ 600V/300A: Eon=8.42mJ/Eoff=7.05mJ
  • Switching Frequency: max 50Khz
  • Isolation (baseplate - power pins): 3600VAC @50Hz (1min)
  • Common Mode Transient Immunity: >50kV/μs
  • Low parasitic capacitance (primary-secondary): typ 11pF per phase
  • Gate Driver Protections: 
    • Under Voltage Lockout (UVLO)
    • Desaturation Protection
    • Soft Shutdown turn-off (SSD)
    • Negative gate drive (-3V)
    • Active Miller Clamping (AMC)
    • Gate-Source Short-circuit Protection


  • Electrical Vehicle (EV) Motor Drives
  • Heavy Duty Motor Drives & Active Rectifiers
  • Industrial Motor Drives

Ordering information

Ordering reference Description Link


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Type Title Link
Download LTspice Model Library for CISSOID's SiC Intelligent Power Modules ZIP
Application note DC-Link Capacitors for CISSOID SiC Intelligent Power Modules Application Note PDF
Application note CXT-PLA3SA Mounting and Cooling Recommendations Application Note PDF
Download CXT-PLA3SA Reference Cooler 3D Printing File for 3D printing in polymer material (PA12) ZIP
Download CXT-PLA3SA Reference Cooler 3D Step file ZIP
Download CMT-PLA3SB 3D Step file (flat baseplate) ZIP
Download CXT-PLA3SA 3D Step file (pin fin baseplate) ZIP
Datasheet Datasheet CXT-PLA3SA12450A PDF


Type Title Link
Press "碳化硅器件挑战现有封装技术", in Electronics and Packaging, February 2022 Read here
Press "碳化硅模块的高温封装已成趋势", in Compound Semiconductor China, March 2022 Read here
Press "车,不用SiC都不好意思叫电动出行", in Power Electronics China, July 2021 Read here
Press "Liquid-cooled Modules with integrated 3-Phase SiC MOSFET", in Power Electronics News, May 2021 Read here
Press "SiC IPMs scupper range anxiety in electric vehicles", in Electronic Specifier, April 2021 Read here
Press CISSOID Cover Story, Electronics Today March 2023 PDF
Press Impact of Increasing Power Density & Switching Frequency on the Thermal Requirements & Design of Gate Drivers, ECPE Workshop on Advanced Drivers, Feb 2022 PDF
Press SiC MOSFET Intelligent Power Module Platform For E-Mobility Applications", presentation at Online Wide Bandgap Conference, Dec 2020 PDF
Press Modulo di Potenza Intelligente per la Mobilità Elettrica, Elettrica Oggi Power, Oct 2020 PDF
Press Intelligent Power Modules Accelerate Transition to SiC-Based Electric Motion, E-Mobility Technology International Magazine, Winter 2020 PDF
Press 三相 1200V/450A SiC MOSFET 电动汽车智能 功率模块, Bodo's Power Systems China Magazine, June 2020 PDF
Press A 3-Phase 1200V/450A SiC MOSFET Intelligent Power Module for E-Mobility, Bodo's Power Systems Magazine, May 2020 PDF