CXT-PLA3BG07820R

3-Phase 750V/820A IGBT Power Module in CPAK-HPC

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The CXT-PLA3BG07820RA is a 750V/820A 3-Phase IGBT Power Module based on the latest generation Trench Gate Field Stop (TG-FS) technology, made and qualified for the most stringent automotive applications. The product offers fast switching, short tail currents and easy paralleling. It also features free wheeling diodes with fast and soft reverse recovery. 

The dense and ellipsoid pinfin grid of the innovative baseplate brings improved thermal performance and reduced flow resistance, significantly boosting the cooling capacity of the baseplate. The power module is AQG-324 automotive qualified and guaranteed to operate over the full -40°C to +175°C (Tj) temperature range.

Benefits

  • 750V IGBT in Trench Gate Field Stop technology
  • VCE(sat) with positive temperature coefficient
  • Fast switching and short tail current
  • Free wheeling diodes with fast and soft reverse recovery
  • Improved baseplate cooling capability
  • Max Junction Temperature of 175°C
  • Embedded NTC temperature sensor

Key features

  • Max Collector Voltage:  750V
  • Implemented Collector Current: 820A
  • DC Collector Current @ TF=80°C: 450A
  • Low Saturation Voltage
    • VCE(sat)= 1.15V @ IC=450A, Tj=25°C
    • VCE(sat)= 1.25V @ IC=450A, Tj=175°C
  • Low Switching Energy
    • Eon= 16.8mJ at Tj=25°C
    • Eoff= 15.7mJ Tj=25°C
  • Gate charge: Qg=1.2µC
  • Operating range -40 to +175°C (Tj)
  • Industry standard package
  • >10% improved cooling capacity
    • Dense & ellipsoid pinfin grid
    • Copper baseplate

Innovative Cooling Technology

The innovative design of the CPAK-H1 module's baseplate brings benefits on several levels. Extensive research has proven that ellipsoid pinfin structures are the most effective, while remaining manufacturable on a large scale. The ellipsoid structures have a larger contact area, thereby increasing the heat-exchanging surfaces. The ellipsoid formfactor thereby increases the cooling effects, and at the same time cause less flow restriction. Increasing the grid density provides even more heat-exchange surface area and also augments the fluid flow in the narrower channels. 

The result is a slightly improved flow resistance and a significantly improved thermal capacity: >10% improvement over the standard structures with circular pinfins.

Applications

  • Electrical Vehicle (EV) Motor Drives
  • Heavy Duty Motor Drives & Active Rectifiers
  • Industrial Motor Drives
  • Power Conversion

Ordering information

Ordering reference Description Package Status Link
CXT-PLA3BG07820RA

3-Phase 750V/820A IGBT Power Module  in CPAK-HPC

CPAK-HPC Active Buy Here

Documents

Type Title Link
Datasheet CXT-PLA3BG07820RA IGBT 3Phase Power Module 1200V/820A CPAK-HPC PDF