SiC INVERTER REFERENCE DESIGN
350kW/850V 3-PHASE SILICON CARBIDE MODULAR INVERTER REFERENCE DESIGN
The SiC Inverter Reference Design is based on CISSOIDs unique hardware and software platform, setting new levels in terms of power density and efficiency, enabling the rapid development of Silicon Carbide (SiC) based inverters for electric drive trains.
The reference design offers a modular electrical and mechanical integration of a 3-phase 1200V/550A SiC MOSFET Intelligent Power Module from CISSOID, combined with the OLEA® T222 FPCU based control board and OLEA® APP INVERTER application software from Silicon Mobility.
To complete the reference design, it includes a DC-Link capacitor, DC and phase current sensors, an EMI filter and liquid cooling.
Key Features
- Up to 350kW/850V
- Modular SiC power module
- Robust SiC gate driver board
- OLEA® T222 FPCU controller
- Advanced control algorithms
- SVPWM or DPWM up to 50kHz
- Low-ESL DC-Link capacitor
- DC & phase current sensors
- 900V/400A EMI filter
- Liquid cooling
Applications
- Electric Vehicle (EV) motor drives
- Heavy duty motor drives (off-road, highway and industrial)
- Avionics and marine motor drives
- High performance motor drives
- Industrial motor drives
Ordering information
Ordering reference | Description | Characteristics | Link |
EVK-PLA1050 |
Lab unit: 394w x 408d x 91h |
Max Power / Voltage range: 350kW / 850V
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Buy Here |
Documents
Type | Title | Link |
Datasheet | CISSOID-SiC-inverter-reference-design-product-guide.pdf | |
Download | LTspice Model Library for CISSOID's SiC Intelligent Power Modules | ZIP |
Application note | DC-Link Capacitors for CISSOID SiC Intelligent Power Modules Application Note | |
Application note | CXT-PLA3SA Mounting and Cooling Recommendations Application Note | |
Download | CXT-PLA3SA Reference Cooler 3D Printing File for 3D printing in polymer material (PA12) | ZIP |
Download | CXT-PLA3SA Reference Cooler 3D Step file | ZIP |
Download | CMT-PLA3SB 3D Step file (flat baseplate) | ZIP |
Download | CXT-PLA3SA 3D Step file (pin fin baseplate) | ZIP |
Articles
Type | Title | Link |
Press | "碳化硅器件挑战现有封装技术", in Electronics and Packaging, February 2022 | Read here |
Press | "碳化硅模块的高温封装已成趋势", in Compound Semiconductor China, March 2022 | Read here |
Press | "车,不用SiC都不好意思叫电动出行", in Power Electronics China, July 2021 | Read here |
Press | Liquid-cooled Modules with integrated 3-Phase SiC MOSFET, in Power Electronics News, May 2021 | Read here |
Press | SiC IPMs scupper range anxiety in electric vehicles, in Electronic Specifier, April 2021 | Read here |
Press | CISSOID Cover Story, Electronics Today March 2023 | |
Press | Impact of Increasing Power Density & Switching Frequency on the Thermal Requirements & Design of Gate Drivers, ECPE Workshop on Advanced Drivers, Feb 2022 | |
Press | SiC MOSFET Intelligent Power Module Platform For E-Mobility Applications", presentation at Online Wide Bandgap Conference, Dec 2020 | |
Press | Modulo di Potenza Intelligente per la Mobilità Elettrica, Elettrica Oggi Power, Oct 2020 | |
Press | Intelligent Power Modules Accelerate Transition to SiC-Based Electric Motion, E-Mobility Technology International Magazine, Winter 2020 | |
Press | 三相 1200V/450A SiC MOSFET 电动汽车智能 功率模块, Bodo's Power Systems China Magazine, June 2020 | |
Press | A 3-Phase 1200V/450A SiC MOSFET Intelligent Power Module for E-Mobility, Bodo's Power Systems Magazine, May 2020 |