CXT-PLA3BG07820R
3-Phase 750V/820A IGBT Power Module in CPAK-HPC
The CXT-PLA3BG07820RA
is a 750V/820A 3-Phase IGBT Power Module based on the latest generation Trench Gate Field Stop (TG-FS) technology,
made and qualified for the most stringent automotive applications. The product offers
fast switching, short tail currents and easy paralleling. It also features free wheeling diodes with fast and soft reverse recovery.
The dense and ellipsoid pinfin grid of the innovative baseplate brings improved thermal performance and reduced flow resistance, significantly boosting the cooling capacity of the baseplate. The power module is AQG-324 automotive qualified and guaranteed to operate
over the full -40°C to +175°C (Tj) temperature range.
Benefits
- 750V IGBT in Trench Gate Field Stop technology
- VCE(sat) with positive temperature coefficient
- Fast switching and short tail current
- Free wheeling diodes with fast and soft reverse recovery
- Improved baseplate cooling capability
- Max Junction Temperature of 175°C
- Embedded NTC temperature sensor
Key features
- Max Collector Voltage: 750V
- Implemented Collector Current: 820A
- DC Collector Current @ TF=80°C: 450A
- Low Saturation Voltage
- VCE(sat)= 1.15V @ IC=450A, Tj=25°C
- VCE(sat)= 1.25V @ IC=450A, Tj=175°C
- Low Switching Energy
- Eon= 16.8mJ at Tj=25°C
- Eoff= 15.7mJ Tj=25°C
- Gate charge: Qg=1.2µC
- Operating range -40 to +175°C (Tj)
- Industry standard package
- >10% improved cooling capacity
- Dense & ellipsoid pinfin grid
- Copper baseplate
Innovative Cooling Technology
The innovative design of the CPAK-HPC module's baseplate brings benefits on several levels. Extensive research has proven that ellipsoid pin-fin structures provide the most effective compromise between thermal and pumping efficiency, while remaining manufacturable on a large scale. The ellipsoid structures have a larger contact area, thereby increasing the heat-exchanging surfaces. The ellipsoid formfactor thereby increases the cooling effects, and at the same time cause less flow restriction. Increasing the grid density provides even more heat-exchange surface area and also augments the fluid flow in the narrower channels.
The optimized design achieves a 0.5% reduction in flow resistance and over 10% higher thermal capacity, offering clear advantages over conventional circular pin-fin structures.
Applications
- Electrical Vehicle (EV) Motor Drives
- Heavy Duty Motor Drives & Active Rectifiers
- Industrial Motor Drives
- Power Conversion
Ordering information
| Ordering reference | Description | Package | Status | Link |
| CXT-PLA3BG07820RA |
3-Phase 750V/820A IGBT Power Module in CPAK-HPC |
CPAK-HPC | Active | Buy Here |
Documents
| Type | Title | Link |
| Datasheet | CXT-PLA3BG07820RA IGBT 3Phase Power Module 1200V/820A CPAK-HPC |